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The People's Bank of China and the China Securities Regulatory Commission recently jointly issued a notice regarding supporting the issuance of technology innovation bonds. Many enterprises, financial institutions, and others quickly responded to promote the debut of the first batch of national technology innovation bonds. Data disclosed by the China Foreign Exchange Trade System showed that from the launch of technology innovation bonds on May 7 to May 14, 14 equity investment institutions completed issuances, and 11 equity investment institutions conducted registrations with a total issuance amount of approximately 20 billion yuan. Issuers are located in regions such as Beijing, Shanghai, Guangdong, and Jiangsu. People's Bank of China Governor Pan Gongsheng recently indicated that preliminary statistics show that nearly 100 market institutions are planning to issue over 300 billion yuan in technology innovation bonds, and it is expected that more institutions will participate in the future. (Economic Daily)