The first batch of technology innovation bond issuance documents are disclosed, with involvement of multiple banks in underwriting.

Tonight, relevant personnel from CITIC Bank introduced to reporters that the first batch of 15 national technology innovation bonds underwritten by CITIC Bank were announced for issuance on that day. Among them, CITIC Bank took the lead in underwriting 9 projects. Another top joint-stock bank also told reporters that the bank is preparing for the issuance of technology innovation bonds, "progress is expected in a few days." Today, several banks and enterprises have officially disclosed the issuance documents for technology innovation bonds. This includes technology companies such as BOE, Hengli Group, and Wanhua Chemical, as well as equity investment institutions such as LuXin Entrepreneurship Investment Group, Suzhou Yuanhe Holding Limited, and Wuxi Entrepreneurship Investment Group, and also includes CITIC Bank and China Development Bank.