SK Hynix releases temperature-controlled heat dissipation storage technology "iHBM"

SK Hynix announced on the 26th that the company has released the "iHBM" technology. This technology significantly reduces the heat generated during product operation by integrating an integrated cooling component "ICE*" within the HBM package. SK Hynix plans to apply the iHBM technology to next-generation products such as HBM5 to meet the strict heat control requirements of highly integrated, high bandwidth applications such as high-performance computing and AI data centers, further improving the overall system stability and operational efficiency.