Daiwa: Apple significantly increases TSMC's SoIC production capacity reservation, targeting "Baltra" AI server chips.

According to the latest analysis report from Morgan Stanley, Apple is laying a key foundation for its next-generation customized chips. In order to drive AI development and improve features like Siri, Apple is significantly increasing its capacity commitment for TSMC's SoIC 3D packaging technology, with a focus on the all-new AI server chip with the codename Baltra, expected to debut in 2027.