Union Consultancy: TSMC and Samsung are cutting 8-inch wafer production capacity, wafer foundries are considering raising prices by 5% to 20%

TSMC and Samsung are reducing their 8-inch wafer capacity, with global 8-inch production expected to decline by 2.4% in 2026. Demand for AI-driven power ICs is becoming a key support for the utilization rate of 8-inch wafer fabs throughout the year. Wafer foundries are considering raising prices by 5% to 20%, but actual increases may be limited due to soft visibility in the end market and cost pressures from rising prices of storage chips and advanced processes.