Institute of Technology: plans to issue technology innovation bonds of no more than 250 million yuan.

The Institute of Building Science announced that the tenth interim meeting of the fourth board of directors of the company approved the proposal to issue technology innovation bonds. The scale of this bond issuance shall not exceed 250 million RMB, with a maturity not exceeding 5 years. The issuance method is non-public offering, with annual interest payments and a one-time repayment at maturity. The funds raised will be used for investment in technology innovation projects, construction and operation, investment, acquisition, or establishment of technology innovation companies, research and development platform construction, and working capital for daily production and operation. This issuance will provide stable and reliable financial support for the company, helping to enhance the overall strategic development. This proposal still needs to be approved by the company's second interim shareholders' meeting in 2025, and implemented after obtaining the no-objection letter from the Shenzhen Stock Exchange.