A total of 14 science and technology innovation bond ETFs raised nearly 40.8 billion yuan.

The second batch of 14 Science and Technology Innovation Bond ETFs collectively disclosed the issuance data today, with a total fundraising size of RMB 40.786 billion. Among them, Industrial Bank's Science and Technology Innovation Bond ETF raised a total of RMB 3 billion, while the other 13 remained within the issuance cap of RMB 3 billion. ETFs issued by institutions such as YinHua, Huatai Bairui, China Bank, Tianhong exceeded RMB 2.99 billion, while those issued by institutions including Guotai, Morgan, Industrial and Commercial Bank, Taikang, Huitianfu, Huaxin, Yongying, and Dacheng exceeded RMB 2.9 billion. Wan Jia's Shenzhen Science and Technology Innovation Bond ETF had an issuance size of RMB 2.127 billion. Only one day into the issuance of the second batch of science and technology innovation bonds, each institution quickly completed their issuance tasks. After listing in late September, the latest size of the bond ETFs will exceed RMB 600 billion.