Huatian Technology: Subsidiaries plan to invest in establishing an industrial fund for the semiconductor chip design, semiconductor packaging and testing equipment materials, and other fields.

Hua Tian Technology announced that its subsidiary Xi'an Tianli Investment Partnership Enterprise, together with Shanghai Shengyu Equity Investment Fund Management Co., Ltd. and Nanjing Shengyu Investment Management Co., Ltd., have jointly invested in the establishment of Jiangsu Hua Tian Shengyu Industrial Investment Fund, with a total subscribed capital of 200 million yuan. Xi'an Tianli, as a limited partner, has subscribed capital of 80 million yuan, accounting for 40% of the total subscribed capital. The industry fund established this time will mainly invest in the semiconductor chip design, semiconductor packaging and testing equipment materials, and other semiconductor industries, actively seeking and fostering high-quality enterprises in the strategic emerging industry field. This is beneficial for exploring synergies with the company's core business of integrated circuit packaging and testing, promoting the integration of the company's industrial resources.