Nearly 100 institutions plan to issue more than 300 billion yuan in bonds - the bond market "technology board" helps scientific innovation.

The People's Bank of China and the China Securities Regulatory Commission recently jointly issued a notice on supporting the issuance of technology innovation bonds. Many enterprises and financial institutions have quickly responded, promoting the debut of the first batch of technology innovation bonds nationwide. Data disclosed by the China Interbank Market Dealers Association showed that from May 7th when the technology innovation bonds were launched to May 14th, 14 equity investment institutions completed issuance, and 11 equity investment institutions started registration, with a total registered issuance amount of approximately 20 billion yuan, covering regions such as Beijing, Shanghai, Guangdong, and Jiangsu. Pan Gongsheng, the Governor of the People's Bank of China, recently stated that preliminary statistics show that nearly 100 market institutions plan to issue over 300 billion yuan of technology innovation bonds, and it is expected that more institutions will participate in the future.