Corelink Semiconductor releases high-performance edge AI SoC for embodied intelligent applications.

On May 13th, Xinchi Semiconductor released a high-performance edge AI SoC - D9-Max, targeting embodied intelligent applications, at the 15th Songshan Lake China IC Innovation Summit. D9-Max uses a multi-core heterogeneous computing architecture, with rich communication interfaces, suitable for applications such as motion control, path planning, perception, voice interaction, sensor data processing, data collection, human-machine interface, etc. CTO Sun Mingle introduced that embodied intelligence and automobiles have a high degree of similarity, and the company provides high-performance chips for embodied intelligence based on automotive standards. Currently, the company has shipped 8 million units of its new chip for smart cabins, covering over 100 car models both domestically and internationally.