Shanghai headquarters of the central bank: Actively promote the landing of the "technology board" in the bond market in Shanghai, and many enterprises are included in the first batch of national pilots.

According to a report from the Shanghai headquarters of the People's Bank of China, with strong support from the People's Bank of China headquarters and the Shanghai Municipal Party Committee and Government, the Shanghai headquarters of the People's Bank of China, in collaboration with the Municipal Committee's Financial Office and other relevant departments, actively promoted the participation of related private equity institutions, technology enterprises, and financial institutions in Shanghai in the country's first batch of technology innovation bond issuances. As of May 9th, two technology enterprises and one equity investment institution in Shanghai have been included in the first pilot program nationwide. Among them, Xinwei Technology Group successfully issued 200 million yuan in technology innovation bonds, with funds raised directly used for equity investments in enterprises related to the integrated circuit industry.