Yangjie Technology's SiC automotive-grade power semiconductor module packaging project has begun.

On May 9th, Yangjie Technology's SiC automotive-grade power semiconductor module packaging project officially started. The total planned investment for this project is 1 billion RMB, focusing on automotive-grade frame-type, plastic-packaged IGBT modules, SiC MOSFET modules, and other third-generation semiconductor products. The products aim to meet international benchmarks, with technical indicators comparable to international leading levels, and they can potentially replace imported products. Once the project is fully operational, it is estimated that annual sales could reach 1 billion RMB, with a tax contribution of 30 million RMB, injecting strong momentum into the local economy.