Science and Technology Innovation Bonds "expansion" frenzy surges as institutions and enterprises rush to issue, with a total amount exceeding 10 billion.

On May 7, the People's Bank of China and the China Securities Regulatory Commission jointly issued a notice regarding supporting the issuance of technology innovation bonds. One of the major highlights is the addition of support for financial institutions, technology companies, private equity investment institutions, and venture capital institutions to issue technology innovation bonds. With the policy trend, major issuers have actively responded. The China Development Bank, Industrial and Commercial Bank of China, Industrial Bank, and many securities firms have announced their issuance plans. According to data from the Securities Dealers Association, as of May 8, 36 companies have announced the issuance of technology innovation bonds, with a total issuance size of 21 billion yuan; 14 companies have begun registration for issuance, with a total registration size of 18 billion yuan. 24 private equity investment institutions have registered to issue technology innovation bonds, with an estimated overall size of nearly 10 billion yuan.