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Tonight, relevant personnel from China CITIC Bank introduced to reporters that the first batch of 15 national technology innovation bonds underwritten by China CITIC Bank was officially announced and issued on the same day. Among them, China CITIC Bank played a leading role in the underwriting of 9 projects. Another top joint-stock bank personnel also informed reporters that the bank is preparing for the issuance of technology innovation bonds and "progress is expected in a few days". Today, several banks and companies have officially disclosed the issuance documents of technology innovation bonds. These include technology companies such as BOE Technology Group, Hengli Group, and Wanhua Chemical, as well as equity investment institutions such as Shandong Luxin Venture Capital Group, Suzhou Yuanhe Holdings Co., Ltd., Wuxi Venture Capital Group, China CITIC Bank, and China Development Bank.
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