Banking, securities firms, and private enterprises are all joining forces, with the first batch of 64.5 billion yuan in science and technology innovation bonds being issued collectively.

Under the policy-driven environment, multiple institutions have announced their plans to issue technology innovation bonds. As of May 8th, data from Enterprise Early Warning Platform showed that various issuers, including securities firms, banks, equity investment and venture capital institutions, have actively disclosed their plans to issue the first tranche of technology innovation bonds in 2025, with a total maximum issuance scale of 64.05 billion yuan.