Shanghai Securities News: The mechanism of science and technology innovation bonds is expected to stimulate China's technological innovation power and improve investment efficiency.

Industry experts believe that the financial regulatory department has launched a "technology board" in the bond market to meet the financing needs of technology-based enterprises and the investment characteristics of equity investment institutions. Through the creation of policy tools and the leadership of technology innovation bonds, a comprehensive support system of "stock and bond linkage" is established to effectively match the financing needs of technology-based enterprises at various stages. This will guide bond market funds to invest early, invest small, invest long-term, and invest in hard technology, stimulating technological innovation and market vitality, and helping to cultivate new productive forces. Equity investment institutions can raise funds through the bond market and other channels, reducing their excessive reliance on government funds and further enhancing investment efficiency. Industry experts believe that the bond market's "technology board" focuses on the needs of national science and technology strategies, and increases support for science and technology industries and technology-based enterprises with significant influence. It is expected to provide key support for technology industries such as artificial intelligence, big data and cloud computing, integrated circuits, industrial automation, quantum technology, biotechnology, and others.