The preparation work for the technology board of the bond market is basically ready.

On May 7th, Pan Gongsheng, the Governor of the People's Bank of China, introduced at a press conference held by the State Council Information Office that the People's Bank of China, together with the China Securities Regulatory Commission, the China Banking and Insurance Regulatory Commission, the Ministry of Science and Technology, and other departments, has actively prepared to launch a "technology board" in the bond market to support financial institutions, technology-based enterprises, and equity investment institutions to issue technology innovation bonds. Currently, relevant policies and preparations are basically ready, and the response from the market has been very positive. Preliminary statistics show that nearly 100 market institutions plan to issue over 300 billion yuan of technology innovation bonds, and it is expected that more institutions will participate in the future.