Chipown Micro: Completion of the 60 million yuan issuance of the first phase of the 2026 scientific innovation bonds.

Xinpeng Micro announced that the company's first phase of technology innovation bonds for the year 2026 has been successfully issued, with a total issuance amount of 600 million yuan. The raised funds were fully received as of July 31, 2026. The bond is referred to as "26 Xinpeng Micro MTN001," with the code 102682858, a term of 1+1 years, an interest start date of July 31, 2026, and a maturity date of July 31, 2028, with an issuance interest rate of 1.60%. The lead underwriter is Ningbo Bank.