Lead the initiation of the national "Quantum Chip Flip Chip Bonding Equipment and Key Technology Research" project.

It was learned by reporters that recently, the national key research and development project on quantum special "Quantum Chip Inverted Bonding Equipment and Key Technology Research" led by Miwei Technology Co., Ltd., a subsidiary of Miwei Group, was successfully launched in the Miwei Technology Semiconductor Industry Park in the Zhuhai High-tech Zone. Miwei Technology led the project, jointly formed an industrial, academic and research collaborative group with Guangdong University of Technology, Harbin Institute of Technology, and Southern University of Science and Technology, focusing on the development of superconducting quantum chip inverted bonding equipment, conducting independent research and development, and promoting prototype development and process verification.