The Samsung Exynos 2700 chip is considering abandoning the advanced FOWLP packaging technology.

According to reports, Samsung plans to stop using FOWLP technology on the Exynos 2700, which has been used since the Exynos 2400. The Exynos 2700 chip is currently being developed for next year's flagship phones. Although FOWLP technology has improved heat dissipation performance, Samsung has begun to reevaluate its profitability due to increased manufacturing costs.