Dongwei Technology and Chuanghao Semiconductor have reached a strategic cooperation agreement to promote breakthroughs in high-end packaging substrate technology and industrial upgrading.

According to Dongwei Technology, recently, the company has officially signed a strategic cooperation agreement with Zhejiang Chuanghao Semiconductor Co., Ltd. The two parties will focus on the IC carrier board manufacturing industry chain, carry out in-depth collaboration in equipment and technology, and work together to promote breakthroughs and upgrades in high-end packaging substrate technology. In the future, the two parties will cooperate to empower the industry chain to be autonomously controllable, jointly create a benchmark for collaboration in the IC carrier board field, and inject new momentum into the development of the high-end semiconductor packaging industry.