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26/02/2026
Market news: The Swedish Armed Forces took "countermeasures" against a drone.
Latest
6 m ago
Google: We will expand the use of the beta version of the Text Guidelines in AI Max to all advertisers worldwide.
6 m ago
JAKKS Pacific: The brand new Naruto series products will debut in the spring of 2027.
6 m ago
Broadcom executives: It is expected that at least 1 million 3D stacked chips will be sold by 2027.
7 m ago
Super Micro Corporation introduces the industry's highest density AMD EPYC 4005 series MicroBlade servers designed for cloud, edge computing, and software-as-a-service workloads.
7 m ago
Broadcom (AVGO.O) product marketing vice president Harish Beladwaj said on Wednesday that based on its stacking design technology, the company expects to sell at least 1 million chips by 2027. This forecast marks the launch of a new product by Broadcom and sets a new sales target, which could bring in revenue worth billions of dollars. These chips are manufactured using a technology developed by Broadcom, which stacks two chips together, allowing different silicon chips to be tightly connected, thus increasing the speed of data transfer from one chip to another. Beladwaj said that the company's stacking technology enables customers to manufacture chips with higher performance and lower energy consumption to meet the rapidly growing computational demands brought by artificial intelligence software. "Now almost all of our customers are starting to adopt this technology," he said.
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