Broadcom executives: It is expected that at least 1 million 3D stacked chips will be sold by 2027.

Harish Baladwaj, Vice President of Product Marketing at Broadcom, said on Wednesday that based on its stacking design technology, the company expects to sell at least 1 million chips by 2027. This prediction marks the launch of a new product by Broadcom and sets a new sales target, which could potentially generate billions of dollars in revenue. These chips are based on a technology developed by Broadcom that stacks two chips together, allowing different silicon pieces to be tightly interconnected, thus increasing the speed of data transfer from one chip to another. Baladwaj stated that the company's stacking technology enables customers to produce chips with higher performance and lower energy consumption to meet the rapidly growing computing demands brought by artificial intelligence software. "Now almost all of our customers have started adopting this technology," he said.