Transonic will release an ultra-thin modular smartphone, which will make its debut at MWC2026.

Transion will showcase an ultra-thin modular phone at MWC 2026, equipped with magnetic contact points on the back that allow users to connect various external devices, enabling the phone to serve different purposes. According to the official teaser image, the phone has a thickness of 4.9mm and a back design similar to the Apple iPhone Air, featuring a single camera design. Included accessories provide a camera handle/telephoto lens, gamepad, action camera, power bank, and lanyard. However, it is worth noting that the positions of the contact points on the back of the phone in the two official images are quite different, indicating that the final hardware design of this phone has not been completed yet, and these two images are for conceptual reference only.