SENASIC (06675) included in Hong Kong Stock Connect: A rare target for Physical AI edge computing.

Starting from September 7, SENASIC (06675) has officially been included in the Hong Kong Stock Connect eligible stock list. This follows the announcement by the Hang Seng Index Company regarding the results of the review of the Hang Seng Index series for the second quarter of 2026, where SENASIC was incorporated into the Hang Seng Composite Index constituent stocks. With the formal entry into the Hong Kong Stock Connect, the accessibility of the company's stock trading and the coverage of mainland investors are expected to improve further. In recent years, SENASIC has continued to deepen its layout around the direction of Physical AI, strategically positioning itself as an entry point for the end-side sensing and computing of Physical AI in the physical world. As the first "Physical AI end-side sensing computing chip stock" listed on the Hong Kong Stock Exchange main board on June 17, 2026, the company was included in the Hong Kong Stock Connect just about two and a half months after its listing, fully reflecting the capital market's recognition of the scarce value of the Physical AI end-side sensing computing sector. As artificial intelligence extends from the digital world into the real physical world, applications in energy storage, automotive, and industrial electronics have a growing demand for high-precision sensing, real-time computing, and low-power transmission. Leveraging its fully self-developed IP platform and adopting a Fabless operating model, SENASIC integrates capabilities such as physical quantity sensing, end-side computing, and low-power wireless transmission into its chips, pushing the capabilities of sensing, computing, and execution further towards the edge. From an operational perspective, the company's fundamentals showed a steady growth trend in the first half of 2026. According to the interim performance announcement, the company achieved operating revenue of approximately 214 million yuan, a year-on-year increase of 36.5%; gross profit of approximately 69.41 million yuan, a year-on-year increase of 63.1%; and overall gross margin improved from about 27.1% in the same period last year to approximately 32.4%. In terms of product lines, the company's three core product linessmart battery cell chips, smart tire chips, and smart general-purpose sensing chipseach maintained over 20% growth, with the revenue from smart battery cell chips increasing by 114.5% year-on-year, becoming the fastest-growing product line during the period. According to the performance announcement, during the reporting period, the company has engaged in R&D collaborations with several leading domestic battery manufacturers, further expanding industrial synergy in the field of intelligent sensing and computing at the cell level. Market participants believe that with its inclusion in the Hong Kong Stock Connect, SENASIC is expected to further expand its channels for southbound funds and reach mainland investors. As Physical AI continues to penetrate real application scenarios in energy storage, automotive, and industrial sectors, the company's product layout and commercialization progress in the field of end-side sensing and computing are also worthy of continued attention.