CIRC (01763) has completed the issuance of 500 million yuan in technology innovation corporate bonds.

19:46 07/09/2026

China Tongfu (01763) announced that China Tongfu Co., Ltd. will publicly issue technology innovation company bonds (First Phase) for professional investors in 2026, with an issuance scale not exceeding RMB 500 million (including 500 million). The issuance work for this phase of the bonds was completed on September 7, 2026. The actual issuance scale of this bond (referred to as: 26 Tongfu K1, code: 246015) is 500 million, with a final coupon rate of 1.50%, and a subscription multiple of 5.86 times.

CIRC (01763) announced that CIRC Co., Ltd. will publicly issue corporate bonds for technological innovation aimed at professional investors in 2026, with a maximum issuance scale of no more than 500 million RMB (including 500 million RMB). The issuance work for this bond has concluded on September 7, 2026. The actual issuance scale for this bond (abbreviated as: 26 Tongfu K1, code: 246015) is 500 million RMB, with a final coupon rate of 1.50% and a subscription multiple of 5.86 times.

Sunresin New Materials (300487.SZ) has signed a daily operational contract for lithium extraction from salt lakes worth 59.726 million yuan.

Estun Automation (02715) has completed the acquisition of 100% equity in Estun Automation Koozhu.

Hong Kong Jifei, a shareholder of Zhejiang Chenfeng Technology (603685.SH), plans to reduce its holdings by no more than 7.57 million shares of the company.

Sunresin New Materials (300487.SZ) has signed a daily operational contract for lithium extraction from salt lakes worth 59.726 million yuan.

Estun Automation (02715) has completed the acquisition of 100% equity in Estun Automation Koozhu.

Hong Kong Jifei, a shareholder of Zhejiang Chenfeng Technology (603685.SH), plans to reduce its holdings by no more than 7.57 million shares of the company.