US Stock Market Move | The stock price rose more than 6% on reports that Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR (TSM.US) is developing a competitive product for Intel Corporation's EMIB.

On Thursday, the stock price of Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR (TSM.US) opened more than 3% higher, with intraday gains reaching as much as 8%, but as of the time of reporting, the gain narrowed to 6%. In terms of news, it was reported that two insiders disclosed that Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR is developing a product similar to the advanced chip packaging technology already established by Intel Corporation, indicating that this global leading chip manufacturer is concerned about competition from rivals. Chip packaging is the final stage of chip production, assembling different silicon wafers into a single unit and wiring them to enable them to function as a whole and connect to other parts of the computer. Insiders stated that within Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADR, engineers refer to this advanced packaging project as "pseudo EMIB" and have already discussed this solution with some clients.