Huaan: Chip integration development drives the new blue ocean of material applications.

Huaan released a research report stating that the aerospace, aviation, and electronics technology fields are developing rapidly, driving chip-level and module-level electronic devices towards miniaturization, multi-functionality, and high power density. The heat dissipation problem of high-power chips is in urgent need of solution, and diamond material with excellent performance is expected to be widely applied. With the further maturity of diamond heat dissipation technology, the commercialization and scale application are expected to continue to expand. According to the calculation of the firm, the conservative estimate is that the market size of diamond heat dissipation is expected to reach 9.7 billion yuan by 2032. The main points of Huaan are as follows: The rapid development in the aerospace, aviation, and electronics technology fields is driving chip-level and module-level electronic devices towards miniaturization, multi-functionality, and high power density. With the development trend of increasing chip integration and size reduction, the functions and performance of chips are further enhanced, but the power consumption and heat dissipation of chips are also increasing. As the service temperature rises, the failure rate of semiconductor components increases significantly. Research shows that with every 18C increase in service temperature, the failure rate of semiconductor components increases two to three times. The heat dissipation problem affects the performance of chips and needs to be solved urgently. AI chip heat dissipation technology optimizes equipment performance and prolongs lifespan by directly removing heat from the chip or processor surface. Traditional solutions mainly include heat dissipation materials and heat dissipation technology. Heat dissipation materials mainly include thermal interface materials (TIM), metal, and ceramic-based heat-conducting materials. In terms of heat dissipation technology, it mainly includes various solutions such as air cooling, liquid cooling, heat pipes, VC heat sinks, and radiators. Electronic packaging plays a protective role for chips and provides rapid heat dissipation. Therefore, electronic packaging materials need to have good thermal conductivity, mechanical properties, and processability to ensure the stability, reliability, and safe operation of electronic devices. Common electronic packaging materials include ceramic materials, plastic materials, metal materials, and composite materials. Diamond thermal sinking material has a natural thermal conductivity of up to 2000-2500W/(m.K), which is four times that of copper and more than eight times that of aluminum. At the same time, its thermal expansion coefficient is highly matched with the core materials of semiconductor chips such as silicon and silicon carbide. The high similarity in thermal properties ensures that diamond thermal sinking can maintain interface stability after experiencing thousands of temperature cycles, effectively avoiding interface delamination problems caused by thermal expansion mismatch. MPCVD method is a preferred method for preparing semiconductor diamond materials. Diamond materials can be divided into single crystal and polycrystalline diamond according to their structure, and the two types of materials exhibit differences in performance and applications. Polycrystalline diamonds are mostly used in areas requiring high thermal conductivity, infrared transparency, and wear resistance, while single crystal diamonds exhibit unique advantages in the ability to withstand high power, high efficiency, and ultra-high frequency operation in electronic devices. Diamond synthesis methods include high-temperature high-pressure method and chemical vapor deposition method. The high-temperature high-pressure method is suitable for large-scale diamond synthesis, while the chemical vapor deposition method is suitable for more precise and controllable diamond growth. Wafer-level diamond for the semiconductor field is prepared through chemical vapor deposition (CVD). Among the three types of CVD methods, including thermal filament method, MPCVD method, and direct current plasma jet method, MPCVD is considered as a preferred method due to its lack of electrode contamination. Related targets: Beijing Worldia Diamond Tools, Sf Diamond Co., Ltd., Sinomach Precision Industry Group Risk Warning: Unexpected delays in technology development; downstream customer product acceptance and product verification are lower than expected; risks of new technology substitution; market demand fluctuation risks; significant increase in raw material costs and impact of raw material procurement difficulties on production risks; macro-environmental risks; intensified market competition risks; exchange rate fluctuation risks; risks of outdated information in research basis, which do not fully reflect the latest industry and company conditions.