New stock news | Copper Technology submits application to Hong Kong Stock Exchange

date
06:24 29/01/2026
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GMT Eight
According to the disclosure by the Hong Kong Stock Exchange on January 28th, Jiangxi Tongbo Technology Co., Ltd. submitted its listing application to the main board of the Hong Kong Stock Exchange, with Guojin Securities (Hong Kong) as its exclusive sponsor.
According to the disclosure of the Hong Kong Stock Exchange on January 28, Jiangxi Copper Foil Technology Co., Ltd. (referred to as Copper Foil Technology) has submitted its listing application to the main board of the Hong Kong Stock Exchange, with Sinolink (Hong Kong) as its exclusive sponsor. The prospectus shows that Copper Foil Technology is a provider of electrolytic copper foil solutions, focusing on the design, research and development, production, and sales of high-performance electrolytic copper foil. According to data from Frost & Sullivan, by sales volume in 2024, the company is the ninth largest electrolytic copper foil producer in China, with a market share of approximately 4.0%. By sales volume in 2024, the company is also the second largest producer of high-performance lithium-ion copper foil in China, with a market share of 13.0%.