Xpeedic Semiconductor releases Agentic AI for Taolaw scenarios

At the 2026 Xinhe User Ecosystem Conference held today, Xinhe Semiconductor released AgentEvo, an Agentic AI super-intelligent agent platform for chiplet and system-level scaling scenarios, used to orchestrate engineering tasks and featuring three built-in super-intelligent agents: advanced packaging, packaging and PCB, and multiphysics coupling. Jiang Liguo, Vice President of R&D at Xinhe Semiconductor, said that the platform is driven by time compression and coordinates architecture optimization, enabling a 4x improvement in design iteration efficiency and an 80% reduction in manual operations.