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NVIDIA and its supply chain partners have reportedly announced expanded capacity to accelerate AI infrastructure buildout. NVIDIA plans to increase substrate capacity to 2.5 times the current level over the next three years; KYEC will receive a US$1.1 billion advance payment from NVIDIA to build new facilities in the United States; Amkor plans to increase advanced packaging capacity by more than 300% by the end of 2028. In addition, NVIDIA plans to double semiconductor testing capacity from 2026 to 2027 and launch large-scale test production in Singapore in February 2027.
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