Xiaomi Intelligent Manufacturing Fund plans to invest RMB 100 million in Suzhou Keyang; the target has already established a presence in optoelectronic packaging and wafer testing.

On the evening of October 9, Dagang Co., Ltd. announced that a consortium formed by Beijing Xiaomi Intelligent Manufacturing Equity Investment Fund Partnership and Shanghai Semiconductor Materials Fund Phase II won a 16% stake in Suzhou Keyang Semiconductor Co., Ltd. for 200 million yuan, with each party intending to contribute 100 million yuan to acquire an 8% stake. The transaction still requires review by the shareholders' meeting and approval by the state-owned asset regulatory authority. According to Tianyancha, the invention patent "An Optoelectronic Packaging Structure and Its Packaging Method" applied for by Suzhou Keyang was published in June this year and is currently in the substantive examination stage. The invention patent "A Wafer-Level Acoustic Function Testing Method and Support Substrate," jointly applied for by the company and Xidian University, was authorized in July this year.