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According to Nikkei, TSMC (TSM.N)-backed chipmaker VIS held a launch ceremony in Singapore on Monday for its first advanced chip manufacturing plant and is already looking to build a second facility. Driven by the AI infrastructure boom, the new plant's capacity was "sold out" as soon as it came online. The wafer fab, named VSMC, is a joint venture between VIS and European chipmaker NXP. The plant began trial production in June, taking only 18 months from construction start to trial productionfar faster than the more than two years typically needed to build a chip factory. VIS said the yield rate for the first batch of chips reached at least 99%. The plant is scheduled to begin mass production in early 2027. The facility will also help TSMC produce critical "interposers" used in advanced chip packaging as substrates connecting different types of chips, serving leading AI chipmakers such as Nvidia, Google, and Broadcom. TSMC is VIS's largest shareholder, with a stake of about 19%.
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