Report: TSMC Plans to Add Five Advanced Packaging Plants

Media cited unnamed supply chain sources in an exclusive report that TSMC plans to add five advanced chip packaging plants in the Chiayi Science Park. The report said TSMC's P1 and P2 plants are expected to enter mass production in 2027, while the P3, P4 and P5 plants under construction in the second phase of the Chiayi Science Park are also progressing in parallel. Once these five additional plants are completed, TSMC's total number of advanced chip packaging plants in Chiayi will reach 10. The report noted that the expansion plan will first be publicly displayed for one month to solicit public opinion, after which it will enter the feasibility study and environmental assessment stages.