Youzu Network, Kangying Semiconductor, and Xiwang will jointly establish a "2.5D/3D Advanced Packaging Center" in the Wuxi High-tech Zone.

According to news from Youzu Interactive, on August 12, Youzu Interactive reached a cooperation agreement with Kangying Semiconductor and Sunrise to jointly establish a "2.5D/3D Advanced Packaging Center" in Wuxi High-tech Zone. The core goal of this project is to build a CoWoS-L full-stack manufacturing service platform, aiming to break through the overseas technology monopoly through innovations in back-end processes and inject new momentum into the independent and controllable development of China's semiconductor industry chain. According to the plan, the "2.5D/3D Advanced Packaging Center" will be constructed in three phases, and once fully completed, it will form a complete advanced packaging system covering key technologies such as bumping, wafer-level packaging, fan-out packaging, and 2.5D/3D heterogeneous integration.