East Asia's computing core WAIC showcases the world's first software-defined cache computing 3D AI chip DF1000 for the first time.

The 2026 World Artificial Intelligence Conference was held in Shanghai from July 17th to 20th. Easton Silicon unveiled the world's first software-defined near-storage computing 3D AI chip DF1000 and won the 2026 SAIL Award for "Outstanding Artificial Intelligence Leader". The chip is built on mature domestic technology, using the "software-defined + 3D stacked near-storage computing" technology route through DRAM-LOGIC Wafer-level mixed bonding for 3D vertical packaging. The core value of this technology route is to achieve a breakthrough in creating a world-class AI computing chip comparable to a 4nm process using domestic 14nm+ mature chip manufacturing technology. Currently, the DF1000 has completed stable operation verification of a large-scale 128-card cluster.