Guangpu Corporation: "R&D and Industrialization Project for Integrated Packaging and Testing of Photoelectric Sensor Components" postponed until June 2028.

Guangpu Shares announced that the company held a board meeting on July 17, 2026, and agreed to extend the date for the "Development and Industrialization Project of Integrated Packaging and Testing of Photoelectric Sensor Components" to reach the scheduled usable status from July 25, 2026 to June 30, 2028, with the condition that the main subject, purpose, and scale of the investment projects remain unchanged. The total investment of the project is 184.6486 million yuan, and as of June 30, 2026, the amount of funds to be used from the raised funds is 15.3651 million yuan. The extension is due to technological iterations and will not have a significant adverse impact on production and operation.