The Shanghai Lingang New Area Xingang Integrated Wafer Manufacturing Project officially started construction.

On June 29th, the groundbreaking ceremony of the Xingang Integration Project in Lingang New Area was officially held at the project site in Xinlu Village, Wanxiang Town. Shanghai Dongfang Xingang Integrated Circuit Co., Ltd. was officially established in November 2025 with an initial registered capital of $5.5 billion, and plans to further increase capital and expand shares in the future. The total construction area of the Xingang Integration Project Phase I is approximately 620,000 square meters. After completion, it will focus on the research and manufacturing of 55nm-28nm planar process integrated circuits, providing integrated circuit foundry services for global customers. The Phase I project is planned to start construction in the third quarter of 2026 and be delivered for use by the end of 2027.