Samsung Electronics and SK Hynix plan to invest 81 trillion Korean won in building HBM packaging facilities.

On June 29th, South Korean government officials announced that Samsung Electronics and SK Hynix plan to invest 81 trillion Korean won in the Chungcheong area of South Korea to construct HBM packaging facilities, further enhancing South Korea's advanced packaging capabilities for AI storage chips. Previously, the South Korean government had announced plans to promote approximately 80 trillion Korean won in corporate investments, to construct four storage chip wafer fabs in the southwest region, and to invest 30 trillion Korean won in research and development of next-generation storage technologies over the next 15 years, accelerating the development of a complete industry chain covering storage manufacturing, advanced packaging, and semiconductor materials equipment.