Yongxie Electronics (688362.SH) plans to invest 10.3 billion yuan to build a new phase III project for high-end integrated circuit (IC) packaging testing in microelectronics.

The Zhitong Finance and Economics APP News reported that Yongxi Electronics (688362.SH) has announced its plan to invest in and construct the "Microelectronics High-end Integrated Circuit IC Packaging and Testing Phase III Project" in the Sino-Italian Ningbo Eco-Park. This move is aimed at seizing the industry development opportunities and further enhancing the company's overall strength and market share. The company has signed an "Investment Agreement" with the Management Committee of the Sino-Italian Ningbo Eco-Park and the Sino-Italian Ningbo Eco-Park Holdings Group Co., Ltd. The total planned investment for the project is 10.3 billion yuan, which includes land transfer fees, factory construction, and equipment procurement costs. The project construction period is expected to be 96 months.