Yongxi Electronics: Plans to invest 10.3 billion yuan to build the third phase of the high-end integrated circuit IC packaging and testing project for microelectronics.

Yongxil Silicon Electronics announcement, the company plans to invest in the construction of the third phase project of advanced integrated circuit IC packaging and testing for microelectronics, with a total planned investment of 10.3 billion yuan. The company has already signed an investment agreement with the Management Committee of China-Italy Ningbo Ecological Park and China-Italy Ningbo Ecological Park Holding Group Co., Ltd. This project still needs to be submitted for approval by the company's shareholders' meeting, and the land for the project needs to be obtained through the statutory auction and bidding procedures, with uncertainties still existing.