Manchester: Currently, the company's products do not involve HBM memory chip packaging or CPO optical module applications.

An investor asked whether the company's coating technology is suitable for hot areas in the current AI industry chain, such as HBM storage chip packaging and CPO optical modules, and whether there is relevant technical reserves or customer contacts. Mancest responded on the interactive platform on June 25th that the company's products currently do not involve the above applications. Please be aware of investment risks.