Xingsen Technology: intends to raise funds of no more than 3.9 billion yuan for high-order mSAP substrate projects.

Xingsen Technology Announcement, the company issued a plan to issue A shares to specific targets in 2026, intending to issue shares to no more than 35 specific targets, raising a total amount of funds not exceeding 3.9 billion yuan. After deducting the issuance expenses, the funds are intended to be used for the intelligent manufacturing and industrialization project of high-end mSAP substrates of Zhuhai Xingsen Semiconductor Co., Ltd., the integrated circuit packaging substrate project of Zhuhai Xingke Semiconductor Co., Ltd., and for supplementary working capital and repayment of bank loans. The number of shares issued this time does not exceed 30% of the total share capital of the company before the issuance, which is no more than 510 million shares. The issuance price is not less than 80% of the average trading price of the company's stock for the 20 trading days before the pricing reference date. This issuance still needs to be approved by the company's shareholders' meeting, approved by the Shenzhen Stock Exchange, and registered by the China Securities Regulatory Commission before it can be implemented.