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The latest report from TrendForce indicates that TSMC is currently focusing on CoPoS and is targeting a 310x310mm substrate size. It is expected that 2026 will be a critical verification period for equipment and material suppliers, with pilot production beginning in 2027 and mass production in the second half of 2028. Additionally, TSMC's next phase of development is expected to shift towards mass production on glass substrates or be achieved after 2030.
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