Huatai Securities: The window of opportunity for domestic substitution has arrived, optimistic about the ultra-fast laser equipment industry.

Huatai Securities pointed out that the rapid growth in demand for AI computing chips and the shortage of traditional packaging materials are accelerating the transformation of advanced packaging materials towards new materials such as glass, ceramics, and M8/M9 grade PCBs. Glass, ceramics, and M8/M9 grade PCBs are all part of the hard and brittle or ultra-high hardness system. Traditional mechanical drilling, wet etching, and ordinary laser processing have poor results, while ultrafast lasers with their cold processing characteristics have become the solution for precision processing. The window for domestic substitutes has arrived, and equipment manufacturers with the ability to provide product solutions are expected to continue to benefit, therefore showing optimism for the ultrafast laser equipment industry.