Hailiang Group: Diamond-Copper Liquid Cooling Precision Components Shine at Shanghai International Data Center Industry Expo.

Today, Hai Liang Group's official Weibo announced that the 12th Shanghai International Data Center Industry Exhibition opened on June 3rd. Hai Liang Group showcased a variety of precision processed core components of liquid cooling systems, including copper bars, heat pipes, and cold plates. In the field of diamond copper, compared to traditional heat management materials, diamond copper composites have ultra-high thermal conductivity, adjustable thermal expansion coefficient, low density, can undergo surface metallization and cutting processing, and have broad applications prospects in fields such as computing servers, optical communication modules, 5G/6G communication base stations, new energy vehicle IGBT power modules, high-end power electronic devices, etc. In the field of high-performance water-cooled plates, the product is currently in the sampling stage. When used together with diamond copper substrates, heat dissipation performance can be further improved by 20%. In the field of heat pipe heat sinks, the product is used for developing phase change heat dissipation solutions for consumer electronics, 5G base stations, industrial temperature control, etc., with fast heat response speed and far superior thermal conductivity to solid metal components.