Sanfu Xinke: Top PCB customers have ordered mSAP plating equipment.

Sanfu New Technology releases an announcement about the record of investor relations activities. Starting in the second half of 2025, the company's high-end VCP electroplating equipment has gradually increased in hand orders, and some equipment has already been shipped. Currently, the company has sufficient orders for equipment in hand, mainly covering VCP electroplating equipment, mSAP electroplating equipment, HVLP5 copper foil electroplating and post-processing equipment, and composite copper foil electrodeposition equipment. In terms of mSAP, some specialized chemicals for mSAP processes have been applied by leading PCB customers, and orders for mSAP electroplating equipment have been received from leading PCB customers. As for glass substrate electroplating, the company's subsidiary Mingyi Electronics has provided specialized equipment for copper electroplating on glass substrates to downstream customers in the board-level fan-out packaging and glass core board manufacturing sectors. The company will conduct in-depth research and development cooperation with strategic customers in terms of processes, materials, and equipment.