Huawei Kirin 2026 mobile phone chip will be unveiled this autumn.

On the 25th, at the International Symposium on Circuits and Systems, He Tingbo, a Huawei director and president of the Semiconductor Business Unit, announced that the Kirin mobile chip, set to debut in the fall of this year, will be the first to adopt logic folding technology, significantly improving performance. He Tingbo stated, "The Kirin 2026 mobile chip is the first successful implementation of logic folding technology." He added, "In the next decade, we will continue to move towards comprehensive folding, even towards more layers of folding, continuously optimizing performance from devices, circuits, to chips and system."