Countdown to the High-NA lithography era! ASML.US announced that the first batch of chips will be available in a few months, with HBM/DRAM teaming up with AI chips to welcome a process leap.

Zhtng cijng APP huxn, hln gungk j jtu smi (ASML.US) de shuxng zhxnggun klstuf fki (Christophe Fouquet) zi zhur biosh, yj shup shyng q xi ydi gungk j j High-NA EUV gungk j shbi zhzo de goxngnng chpin jing zi wili j g yu ni zhngsh jiof. Gnj smi gunfng miosh, High-NA EUV jing minxing 2nm zu fngxin chpin zhchng zhhu yuq 1.8nm/1.4nm jbi j gng hux chchng dinjin txng hu pngti, hi jing fgi DRAM dng cnch chpin zu gunjin zhzo cng.