Huahaiqingke's first 12-inch wafer thinning equipment for advanced storage has been successfully produced.

According to the news from China Resources Microelectronics (CR Micro), recently, the first set of Versatile-GH300 equipment, a new 12-inch wafer thinning equipment for advanced storage, has been officially delivered to a leading domestic integrated circuit manufacturer. The launch of this equipment signifies further improvement in CR Micro's thinning equipment matrix, and is an important strategic move for the company in the high-end thinning field. The Versatile-GH300 can not only meet the ultra-precise processing requirements of 3D integration technology, but also provide strong support for industrial technology iteration and rapid development.